EMU Technologies Batch Wafer Edge Inspection system combines our Batch ID Reader and AI Enabled Vision Inspection system to provide an ultra high-throughput and extremely versatile wafer edge inspection solution.
The equipment performs a batch align and read cycle to read lasermarks and/or datamatrix tags on each wafer.
The equipment then rotates wafers using the batch aligner for edge defect inspection.
An algorithm is trained to identify edge defects, which is deployed to the camera as a job.
The machine can be connected to the host with SECS/GEM, providing a Pass/Fail result for each wafer in the Lot.
Defective wafer images are displayed on the user interface for analysis, if required.
With a typical cycle time of 3 minutes for a Batch ID Read and Batch Inspection, the machine can process up to 500wph with reading and 1500wph for edge inspection only.
